Pic 1 : SWIFT B569-174 Is a tan coloured, fast setting packaging grade, which exhibits good tack, flexibility and a tolerant open time. B569-174 will run cleanly on wheel and jetting applicators.

Pic 1 : SWIFT B569-38 Is a high tack, short open time, packaging hot melt. It is suitable for carton sealing and forming applications. B569-38 will bond a wide variety of substrates including paper and board, some coated and varnished board and polyethylene board. Bonds made with B569-38 are effective under deep freeze conditions depending upon the substrates involved. B569-38 runs efficiently on wheel and jetting applicators.

Pic 1 : Forbo 3 is a exceptionaly heat stable hot melt adhesive. This grade displays a fast setting speed. excellent hot tack and tolerant open time. Forbo 3 will bond a variety of coated and uncoated boards for cases, cartons and trays. This product exhibits heat resistance and deep freeze capabilities. It can be applied cleanly by jetting and wheel in pot applicators.

Pic 1: SWIFT B750/3 is a high tack, medium open time packaging hot melt. It will bond a wide variety of substrates including paper and board ( including polyethylene coated board ) and some plastic materials, breaking cleanly from the plastic. B750/3 is a very clean running adhesive which allows more time available for production. Runs cleanly on wheel, spray and jetting applicators.

Pic 2 : SWIFT EE8003 is a pressure sensitive adhesive supplied in pilotak form which allows the whole block (including packaging) to be put in the melting tank eliminating the need to remove and dispose of silicone release paper. EE8003 will bond a variety of substrates including paper, board, wood, plastics, foam etc.